一、所有参会人员、工作人员、志愿者在进入会场时，应主动出示粤康码，接受体温监测，在会议期间全程佩戴口罩。如粤康码等电子健康码为红码、黄码或体温≥37.3℃，不得进入会议现场。粤康码可通过以下方式获得：

1. 1、打开微信，点击搜索按钮，输入粤省事，点击粤省事；
2. 点击选择所在广东省的市区。
3. 点击粤康码；
4. 点击健康情况申报；
5. 点击个人自查健康申报；
6. 输入相关信息，点击下一步进行申请即可。

二、按照广州市相关防疫要求，参会前14天有境外或国内中高风险地区旅居史的参会人员、工作人员、志愿者，必须提供参会前7天内的“核酸检测阴性证明”。（中高风险地区名单可在“国务院客户端小程序”查询）

ICEPT 2020 会务组
2020年8月3日

• PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
  Dr. Ning-Cheng Lee (Online)
• PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
  Dr. Yifan Guo (Online)
• PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
  Prof. Daquan Yu
• PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
  Prof. Sheng Liu
• PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
  Dr. Ziyang GAO (Online)
• PDC-6: Emerging Power Packaging Technology and Process
  Dr. Carlos Chow (Online)
• SIAT Session: Advanced Electronic Packaging Materials Research and Application
  Prof. Rong Sun

• Design Challenges for Advanced Packaging of Electronic Systems
  Prof. Chris Bailey (Online), President of IEEE EPS, University of Greenwich, UK
• The new reality (Challenges and Opportunities) of Global Semiconductor Industry
  Lung Chu, SEMI China, China
• Latest Progress on the Standardization of Packaging Technology Within JEDEC
  Dr. Kayleen L. E. Helms (Online), Intel, USA
• 1D, 2D and 3D Carbon Materials for Supercapacitor and Cooling applications
  Prof. Johan Liu (Online), Chalmers University of Technology, Sweden, Shanghai University, China
• Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications
  Dr. Akitsu Shigetou (Online), National Institute for Materials Science, Japan
• Digital Twin Enabled Heterogenous System Integration
  Prof. Kouchi Zhang, Delft University of Technology, Netherlands
• New Results on Electromigration Modeling – A Departure from Blech’s Theory
  Prof. Xuejun Fan (Online), Lamar University, USA
• Prospect of Panel Level Fan-Out Packaging in the AI/5G Era
  Dr. Farhang Yazdani (Online), BroadPak Corporation, USA
• Heterogeneous Integration Roadmap – Driving Force and Enabling Technology for System of the Future
  William Chen (Online), ASE Group, China
• Radio-Front-End-Module in Package for 5G and B5G Applications
  Prof. Fujiang Lin, University of Science and Technology of China (USTC), China
• Modeling Based Research and Development for Key Electronic Manufacturing Equipment
  Prof. Sheng Liu, Wuhan University, China
• The Integrated Circuits and Packaging Affecting Healthcare
  Prof. Zhihua Wang, Tsinghua University, China

• Synthesis and Performance of Silver and Copper Nanomaterials for Advanced Electronic Packaging
  Xi Wu, Shenzhen Institutes of Advanced Technology, CAS
• Novel Micro-LED Display and Its Applications
  Zhaojun Liu, Southern University of Science and Technology
• PLP Solutions for HVM of 3D Integrated Systems
  Tanja Braun (Online), IZM Frauhold, Germany
• Thermal Modeling and Design of 3D Memory Stack on Processor with Thermal Bridge Structure
  Hengyun Zhang, Shanghai University of Engineering Science
• Research Methods on Wafer Backside Grinding
  Pei Chen, Beijing University of Technology
• Application of Temporary Bonding / Debonding Technology in Advanced Packaging
  Guoping Zhang, Shenzhen Institute of advanced Technology, CAS
• Overview of Fan-In and Fan-Out Wafer Level Packaging (WLP) Development
  Daping Yao, National Center for Advanced Packaging Co., Ltd
• 2.5D Packaging for 4×56Gbps PAM4 Optical Module Using Silicon Interposer
  Yu SUN, IME, CAS
• The Technology and Challenging of PLP for 3D Packaging
  Forllin Tan, SMAT
• Progress and Applications of Panel Level Packaging
  Xun Huan, Fozhixin Microelectronics Technology Researh Co., Ltd
• Multiphysics Design in Power Electronics Packaging
  Daohui Li (Online), Dynex Semiconductor Ltd
• Electrodeposited Micro/Nano Cone Arrays Applied in Low Temperature Bonding for High Density 3D Packaging
  Yunwen Wu, Shanghai Jiao Tong University
• Advanced Packaging Technology for SiC Power Device
  Jing Zhang, Heraeus Shanghai
• Wafer-Level Micro-Scale Precision Manufacturing for Advanced System Packaging
  Daquan Yu, Xiamen University, Xiamen Sky Semiconductor Co., Ltd
• Analysis of Heat Dissipation Characteristics of Three-Dimensional Graphene-Carbon Nanotube Composite Structures
  Yan Zhang, Shanghai University.
• Research on The Topology and Control Strategy of A High Frequency & High Efficiency Converter for The Isolated DC-DC Power Supplies
  Qinsong Qian, Southeast University
• Advanced interconnects to enable integration and manufacture of power electronics with wide-band gap (WBG) devices
  Changqing Liu (online), Loughborough University
• Development of New Low Dk/Df Material for 5G Application
  Masaaki Saito, JSR
• Microsystem Reliability and Application Research
  Yunfei En, The 5^th Institute of Electronics of MIIT
• How to Make Packaging Equipment Faster and More Accurate
  Yunbo He, Ada
• Warpage Simulation, Experimental Verification and Optimization Analysis for the Panel-Level Fan-Out Packaging
  Fengze Hou (Online), Delft University of Technology
• A System-in-Package Solution
  Weijie Zhang, Wuxi Sky Chip Interconnection Technology Co., Ltd
• Research On FOPLP Package of Power Module
  Jun Li, Wuxi Sky Chip Interconnection Technology Co., Ltd

ICEPT 2020 会议现已开放注册. 会议将按计划于2020.8.12-15日在广州科学城会议中心举行。请认真填写会议注册表并电子邮件至会务组，以便做好各项安排工作:

• English Version: Registration Form Eng
• Chinese Version: Registration Form Chn

会务组联系方式：

• 甘凤华  Tel: 021-38953725   38953726      Email: faithsh@yeah.net
• 张    爽  Tel: 010-64655251    Email: zhangs1189@sina.com
• 施玥如  Tel:021-60345020     Email: janey@cepem.com.cn

拟参会的作者，请注意海报尺寸为A0 (1.2m*0.9m)。分会常规演讲的总时间为15分钟。推荐使用本次会议的PPT模板和海报模板：

• PPT模板：ICEPT-2020-Template-Presentation
• 海报模板：ICEPT-2020-Template-Poster

有任何问题，欢迎联系icept2020@gdut.edu.cn。