- PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
Dr. Ning-Cheng Lee (Online) - PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
Dr. Yifan Guo (Online) - PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
Prof. Daquan Yu - PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
Prof. Sheng Liu - PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
Dr. Ziyang GAO (Online) - PDC-6: Emerging Power Packaging Technology and Process
Dr. Carlos Chow (Online) - SIAT Session: Advanced Electronic Packaging Materials Research and Application
Prof. Rong Sun
大会主旨报告
- Design Challenges for Advanced Packaging of Electronic Systems
Prof. Chris Bailey (Online), President of IEEE EPS, University of Greenwich, UK - The new reality (Challenges and Opportunities) of Global Semiconductor Industry
Lung Chu, SEMI China, China - Latest Progress on the Standardization of Packaging Technology Within JEDEC
Dr. Kayleen L. E. Helms (Online), Intel, USA - 1D, 2D and 3D Carbon Materials for Supercapacitor and Cooling applications
Prof. Johan Liu (Online), Chalmers University of Technology, Sweden, Shanghai University, China - Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications
Dr. Akitsu Shigetou (Online), National Institute for Materials Science, Japan - Digital Twin Enabled Heterogenous System Integration
Prof. Kouchi Zhang, Delft University of Technology, Netherlands - New Results on Electromigration Modeling – A Departure from Blech’s Theory
Prof. Xuejun Fan (Online), Lamar University, USA - Prospect of Panel Level Fan-Out Packaging in the AI/5G Era
Dr. Farhang Yazdani (Online), BroadPak Corporation, USA - Heterogeneous Integration Roadmap – Driving Force and Enabling Technology for System of the Future
William Chen (Online), ASE Group, China - Radio-Front-End-Module in Package for 5G and B5G Applications
Prof. Fujiang Lin, University of Science and Technology of China (USTC), China - Modeling Based Research and Development for Key Electronic Manufacturing Equipment
Prof. Sheng Liu, Wuhan University, China - The Integrated Circuits and Packaging Affecting Healthcare
Prof. Zhihua Wang, Tsinghua University, China
分会主旨报告
- Synthesis and Performance of Silver and Copper Nanomaterials for Advanced Electronic Packaging
Xi Wu, Shenzhen Institutes of Advanced Technology, CAS - Novel Micro-LED Display and Its Applications
Zhaojun Liu, Southern University of Science and Technology - PLP Solutions for HVM of 3D Integrated Systems
Tanja Braun (Online), IZM Frauhold, Germany - Thermal Modeling and Design of 3D Memory Stack on Processor with Thermal Bridge Structure
Hengyun Zhang, Shanghai University of Engineering Science - Research Methods on Wafer Backside Grinding
Pei Chen, Beijing University of Technology - Application of Temporary Bonding / Debonding Technology in Advanced Packaging
Guoping Zhang, Shenzhen Institute of advanced Technology, CAS - Overview of Fan-In and Fan-Out Wafer Level Packaging (WLP) Development
Daping Yao, National Center for Advanced Packaging Co., Ltd - 2.5D Packaging for 4×56Gbps PAM4 Optical Module Using Silicon Interposer
Yu SUN, IME, CAS - The Technology and Challenging of PLP for 3D Packaging
Forllin Tan, SMAT - Progress and Applications of Panel Level Packaging
Xun Huan, Fozhixin Microelectronics Technology Researh Co., Ltd - Multiphysics Design in Power Electronics Packaging
Daohui Li (Online), Dynex Semiconductor Ltd - Electrodeposited Micro/Nano Cone Arrays Applied in Low Temperature Bonding for High Density 3D Packaging
Yunwen Wu, Shanghai Jiao Tong University - Advanced Packaging Technology for SiC Power Device
Jing Zhang, Heraeus Shanghai - Wafer-Level Micro-Scale Precision Manufacturing for Advanced System Packaging
Daquan Yu, Xiamen University, Xiamen Sky Semiconductor Co., Ltd - Analysis of Heat Dissipation Characteristics of Three-Dimensional Graphene-Carbon Nanotube Composite Structures
Yan Zhang, Shanghai University. - Research on The Topology and Control Strategy of A High Frequency & High Efficiency Converter for The Isolated DC-DC Power Supplies
Qinsong Qian, Southeast University - Advanced interconnects to enable integration and manufacture of power electronics with wide-band gap (WBG) devices
Changqing Liu (online), Loughborough University - Development of New Low Dk/Df Material for 5G Application
Masaaki Saito, JSR - Microsystem Reliability and Application Research
Yunfei En, The 5th Institute of Electronics of MIIT - How to Make Packaging Equipment Faster and More Accurate
Yunbo He, Ada - Warpage Simulation, Experimental Verification and Optimization Analysis for the Panel-Level Fan-Out Packaging
Fengze Hou (Online), Delft University of Technology - A System-in-Package Solution
Weijie Zhang, Wuxi Sky Chip Interconnection Technology Co., Ltd - Research On FOPLP Package of Power Module
Jun Li, Wuxi Sky Chip Interconnection Technology Co., Ltd
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