培训课程

  • PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
    Dr. Ning-Cheng Lee (Online)
  • PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
    Dr. Yifan Guo (Online)
  • PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
    Prof. Daquan Yu
  • PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
    Prof. Sheng Liu
  • PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
    Dr. Ziyang GAO (Online)
  • PDC-6: Emerging Power Packaging Technology and Process
    Dr. Carlos Chow (Online)
  • SIAT Session: Advanced Electronic Packaging Materials Research and Application
    Prof. Rong Sun

大会主旨报告

  • Design Challenges for Advanced Packaging of Electronic Systems
    Prof. Chris Bailey (Online), President of IEEE EPS, University of Greenwich, UK
  • The new reality (Challenges and Opportunities) of Global Semiconductor Industry
    Lung Chu, SEMI China, China
  • Latest Progress on the Standardization of Packaging Technology Within JEDEC
    Dr. Kayleen L. E. Helms (Online), Intel, USA
  • 1D, 2D and 3D Carbon Materials for Supercapacitor and Cooling applications
    Prof. Johan Liu (Online), Chalmers University of Technology, Sweden, Shanghai University, China
  • Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications
    Dr. Akitsu Shigetou (Online), National Institute for Materials Science, Japan
  • Digital Twin Enabled Heterogenous System Integration
    Prof. Kouchi Zhang, Delft University of Technology, Netherlands
  • New Results on Electromigration Modeling – A Departure from Blech’s Theory
    Prof. Xuejun Fan (Online), Lamar University, USA
  • Prospect of Panel Level Fan-Out Packaging in the AI/5G Era
    Dr. Farhang Yazdani (Online), BroadPak Corporation, USA
  • Heterogeneous Integration Roadmap – Driving Force and Enabling Technology for System of the Future
    William Chen (Online), ASE Group, China
  • Radio-Front-End-Module in Package for 5G and B5G Applications
    Prof. Fujiang Lin, University of Science and Technology of China (USTC), China
  • Modeling Based Research and Development for Key Electronic Manufacturing Equipment
    Prof. Sheng Liu, Wuhan University, China
  • The Integrated Circuits and Packaging Affecting Healthcare
    Prof. Zhihua Wang, Tsinghua University, China

分会主旨报告

  • Synthesis and Performance of Silver and Copper Nanomaterials for Advanced Electronic Packaging
    Xi Wu, Shenzhen Institutes of Advanced Technology, CAS
  • Novel Micro-LED Display and Its Applications
    Zhaojun Liu, Southern University of Science and Technology
  • PLP Solutions for HVM of 3D Integrated Systems
    Tanja Braun (Online), IZM Frauhold, Germany
  • Thermal Modeling and Design of 3D Memory Stack on Processor with Thermal Bridge Structure
    Hengyun Zhang, Shanghai University of Engineering Science
  • Research Methods on Wafer Backside Grinding
    Pei Chen, Beijing University of Technology
  • Application of Temporary Bonding / Debonding Technology in Advanced Packaging
    Guoping Zhang, Shenzhen Institute of advanced Technology, CAS
  • Overview of Fan-In and Fan-Out Wafer Level Packaging (WLP) Development
    Daping Yao, National Center for Advanced Packaging Co., Ltd
  • 2.5D Packaging for 4×56Gbps PAM4 Optical Module Using Silicon Interposer
    Yu SUN, IME, CAS
  • The Technology and Challenging of PLP for 3D Packaging
    Forllin Tan, SMAT
  • Progress and Applications of Panel Level Packaging
    Xun Huan, Fozhixin Microelectronics Technology Researh Co., Ltd
  • Multiphysics Design in Power Electronics Packaging
    Daohui Li (Online), Dynex Semiconductor Ltd
  • Electrodeposited Micro/Nano Cone Arrays Applied in Low Temperature Bonding for High Density 3D Packaging
    Yunwen Wu, Shanghai Jiao Tong University
  • Advanced Packaging Technology for SiC Power Device
    Jing Zhang, Heraeus Shanghai
  • Wafer-Level Micro-Scale Precision Manufacturing for Advanced System Packaging
    Daquan Yu, Xiamen University, Xiamen Sky Semiconductor Co., Ltd
  • Analysis of Heat Dissipation Characteristics of Three-Dimensional Graphene-Carbon Nanotube Composite Structures
    Yan Zhang, Shanghai University.
  • Research on The Topology and Control Strategy of A High Frequency & High Efficiency Converter for The Isolated DC-DC Power Supplies
    Qinsong Qian, Southeast University
  • Advanced interconnects to enable integration and manufacture of power electronics with wide-band gap (WBG) devices
    Changqing Liu (online), Loughborough University
  • Development of New Low Dk/Df Material for 5G Application
    Masaaki Saito, JSR
  • Microsystem Reliability and Application Research
    Yunfei En, The 5th Institute of Electronics of MIIT
  • How to Make Packaging Equipment Faster and More Accurate
    Yunbo He, Ada
  • Warpage Simulation, Experimental Verification and Optimization Analysis for the Panel-Level Fan-Out Packaging
    Fengze Hou (Online)Delft University of Technology
  • A System-in-Package Solution
    Weijie Zhang, Wuxi Sky Chip Interconnection Technology Co., Ltd
  • Research On FOPLP Package of Power Module
    Jun Li, Wuxi Sky Chip Interconnection Technology Co., Ltd

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