The ICEPT Outstanding Contribution Honorary Award, aims to honor outstanding scholars who have made significant contributions to the ICEPT conference and the advancement of domestic packaging technology. These experts have made highly innovative contributions to ICEPT. Each time they take on key roles in the conference (including conference chair, technical committee chair, etc.), they have elevated ICEPT to a new level and had a significant impact on the conference, the industry, and even society, promoting the progress and development of electronic packaging.

Awards Lists:

	Kouchi ZHANG Academician ofthe Dutch Academy of Engineering IEEE Fellow Secretary General of IEEE International Wide Band Gap Power Electronics Technology Roadmap Committee Director Professor of Integration and Reliability of micro-and Nano-electronic Systems, Delft University, the Netherlands
	Johan LIU Prof. of Shanghai University Prof. of Chalmers University of Science & Technology, Sweden Member of Royal Swedish Academy of Engineering, Sweden
	Ricky LEE Hongkong University of Science & Technology (Guangzhou), China
	Xuejun FAN Lamar University, Beaumont, Texas, USA
	James CAI Tsinghua University