ICEPT

FILE LINK

2024-12-11

ICEPT 2025 ｜Call For Papers

2024-09-02

ICEPT 2024 ｜The 25th International Conference on Electronic Packaging Technology was successfully held in Tianjin

2024-09-02

ICEPT 2024 ｜Best Poster Presentation

2024-09-02

ICEPT 2024 ｜Best Oral Presentation

2024-08-05

ICEPT 2024｜Conference Program

2024-07-26

ICEPT 2024｜Major Participating Companies

2024-07-11

ICEPT 2024｜The key guests

2024-07-04

ICEPT 2024｜OVERVIEW OF CONFERENCE PROGRAM

2024-05-20

ICEPT 2024｜Registration

2024-04-28

ICEPT 2024｜Accepted Abstract

2024-02-20

ICEPT 2024｜Abstract Submission Guideline

2023-09-28

ICEPT 2023｜Post-meeting Report

2023-09-28

The 24th International Conference on Electronic Packaging Technology was successfully held

IMPORTANT DATE

MORE >

Deadline for Submission of Abstract

March 20, 2025

Notification of Abstract Acceptance

April 20, 2025

Hotel

Technical Topic

SPONSORED BY

Meeting Secretary

Shanghai University（Submit Contact）

0086-010-64655251

icept@fsemi.tech

Wen YIN

0086-010-82995675

Janey SHI

0086-13661508648

janey@fsemi.tech

Conference Registration

Yico WANG

0086-13121110782

support@fsemi.tech

Judy ZHOU

0086-13683163150

juanjuan.zhou@fsemi.tech

ABOUT US

MORE >

The International Conference on Electronic Packaging Technology (ICEPT) is the largest and most cohesive packaging technology conference in Asia, which is hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) and Shanghai University, IEEE Electronics Packaging Society (IEEE...

MORE >