Professional Development Course

  • PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
    Dr. Ning-Cheng Lee (Online)
  • PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
    Dr. Yifan Guo (Online)
  • PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
    Prof. Daquan Yu
  • PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
    Prof. Sheng Liu
  • PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
    Dr. Ziyang GAO (Online)
  • PDC-6: Emerging Power Packaging Technology and Process
    Dr. Carlos Chow (Online)
  • SIAT Session: Advanced Electronic Packaging Materials Research and Application
    Prof. Rong Sun

Plenary Talks

  • Design Challenges for Advanced Packaging of Electronic Systems
    Prof. Chris Bailey (Online), President of IEEE EPS, University of Greenwich, UK
  • The new reality (Challenges and Opportunities) of Global Semiconductor Industry
    Lung Chu, SEMI China, China
  • Latest Progress on the Standardization of Packaging Technology Within JEDEC
    Dr. Kayleen L. E. Helms (Online), Intel, USA
  • 1D, 2D and 3D Carbon Materials for Supercapacitor and Cooling applications
    Prof. Johan Liu (Online), Chalmers University of Technology, Sweden, Shanghai University, China
  • Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications
    Dr. Akitsu Shigetou (Online), National Institute for Materials Science, Japan
  • Digital Twin Enabled Heterogenous System Integration
    Prof. Kouchi Zhang, Delft University of Technology, Netherlands
  • New Results on Electromigration Modeling – A Departure from Blech’s Theory
    Prof. Xuejun Fan (Online), Lamar University, USA
  • Prospect of Panel Level Fan-Out Packaging in the AI/5G Era
    Dr. Farhang Yazdani (Online), BroadPak Corporation, USA
  • Heterogeneous Integration Roadmap – Driving Force and Enabling Technology for System of the Future
    William Chen (Online), ASE Group, China
  • Radio-Front-End-Module in Package for 5G and B5G Applications
    Prof. Fujiang Lin, University of Science and Technology of China (USTC), China
  • Modeling Based Research and Development for Key Electronic Manufacturing Equipment
    Prof. Sheng Liu, Wuhan University, China
  • The Integrated Circuits and Packaging Affecting Healthcare
    Prof. Zhihua Wang, Tsinghua University, China

Session Keynote Presentations

  • Synthesis and Performance of Silver and Copper Nanomaterials for Advanced Electronic Packaging
    Xi Wu, Shenzhen Institutes of Advanced Technology, CAS
  • Novel Micro-LED Display and Its Applications
    Zhaojun Liu, Southern University of Science and Technology
  • PLP Solutions for HVM of 3D Integrated Systems
    Tanja Braun (Online), IZM Frauhold, Germany
  • Thermal Modeling and Design of 3D Memory Stack on Processor with Thermal Bridge Structure
    Hengyun Zhang, Shanghai University of Engineering Science
  • Research Methods on Wafer Backside Grinding
    Pei Chen, Beijing University of Technology
  • Application of Temporary Bonding / Debonding Technology in Advanced Packaging
    Guoping Zhang, Shenzhen Institute of advanced Technology, CAS
  • Overview of Fan-In and Fan-Out Wafer Level Packaging (WLP) Development
    Daping Yao, National Center for Advanced Packaging Co., Ltd
  • 2.5D Packaging for 4×56Gbps PAM4 Optical Module Using Silicon Interposer
    Yu SUN, IME, CAS
  • The Technology and Challenging of PLP for 3D Packaging
    Forllin Tan, SMAT
  • Progress and Applications of Panel Level Packaging
    Xun Huan, Fozhixin Microelectronics Technology Researh Co., Ltd
  • Multiphysics Design in Power Electronics Packaging
    Daohui Li (Online), Dynex Semiconductor Ltd
  • Electrodeposited Micro/Nano Cone Arrays Applied in Low Temperature Bonding for High Density 3D Packaging
    Yunwen Wu, 
    Shanghai Jiao Tong University
  • Advanced Packaging Technology for SiC Power Device
    Jing Zhang, Heraeus Shanghai
  • Wafer-Level Micro-Scale Precision Manufacturing for Advanced System Packaging
    Daquan Yu, Xiamen University, Xiamen Sky Semiconductor Co., Ltd
  • Analysis of Heat Dissipation Characteristics of Three-Dimensional Graphene-Carbon Nanotube Composite Structures
    Yan Zhang, Shanghai University.
  • Research on The Topology and Control Strategy of A High Frequency & High Efficiency Converter for The Isolated DC-DC Power Supplies
    Qinsong Qian, 
    Southeast University
  • Advanced interconnects to enable integration and manufacture of power electronics with wide-band gap (WBG) devices
    Changqing Liu (online), Loughborough University
  • Development of New Low Dk/Df Material for 5G Application
    Masaaki Saito JSR
  • Microsystem Reliability and Application Research
    Yunfei En, The 5th Institute of Electronics of MIIT
  • How to Make Packaging Equipment Faster and More Accurate
    Yunbo He, Ada
  • Warpage Simulation, Experimental Verification and Optimization Analysis for the Panel-Level Fan-Out Packaging
    Fengze Hou (Online) , Delft University of Technology
  • A System-in-Package Solution
    Weijie Zhang, Wuxi Sky Chip Interconnection Technology Co., Ltd
  • Research On FOPLP Package of Power Module
    Jun Li, Wuxi Sky Chip Interconnection Technology Co., Ltd

Open for Registration

The ICEPT 2020 is now open for registration. The conference will be held in Guangzhou Science City Convention Center, August 12-15th, 2020. Please fill out the registration form: 

Then, email the form to the following addresses:

  • Zhang Shuang (zhangs1189@sina.com/86-10-64655251)
  • Faith Gan (faithsh@yeah.net/86-021-38953725)
  • Janey Shi (Janey@cepem.com.cn/86-021-60345020)

For speakers, the poster size should be A0 (1.2m* 0.9m), you can find templates of slide and poster:

If you have any enquiry, please contact at icept2020@gdut.edu.cn.