2024 25th International Conference on Electronic Packaging Technology
English
Chinese
HOSTED BY
ORGANIZED BY
CONTACT US
Meeting Secretary
Longnv LI
0086-13998290967(Submit Contact)
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Kunxia SONG
0086-13821459422
Yico WANG
0086-010-64655241
0086-13121110782
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
https://easychair.org/conferences/?conf=icept2024
2024 Brief guide for authors abstract stage
ICEPT-2024_Abstract-Template
ICEPT-2024_Manuscript_Template
ICEPT-2024-Template-Poster
ICEPT-2024-Template-Presentation
2024 Brief guide for authors full paper stage
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.
March 20, 2024
March 31, 2024
April 27, 2024
April 20, 2024
May 27, 2024
June 30, 2024
August 6, 2024
August 7, 2024
August 8-9, 2024
13998290967(Submit Contact)
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