Yun-Hui Mei  Pro. of School of Electrical Engineering, Tiangong University

Mei Yunhui is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.

Pingjuan Niu  Deputy Director of the Information Science Department of Tiangong University, Executive Vice Dean of the School of Electronic & Information Engineering

Director of the Ministry of Education Engineering Research Center for High Power Solid-state Lighting Application Systems, and Director of the Tianjin Solid-state Lighting Technology Engineering Center. She is also the head of the Semiconductor Light Source System Committee of the China Electrotechnical Society and Deputy Secretary General of CSA. Her main research areas include semiconductor light source systems and power electronic device technology. 

Wen YIN  Institute of Microelectronics of Chinese Academy of Sciences, China

Lei SHI   Chairman and President of TongFu Microelectronics Co., Ltd.

PhD from Fudan University, Senior Engineer, State Council Special Allowance Expert, National Thousand Talents Plan Expert, and Innovative Leading Talent of the Ministry of Science and Technology.  The current Chairman and President of TongFu Microelectronics Co., Ltd., Director of National Enterprise Technology Center, Director of Jiangsu Province Advanced Packaging and Testing Key Laboratory, and Dean of Tongfu Microelectronics Research Institute. He also serves as the Executive Vice Chairman of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance, Vice Chairman of the China Semiconductor Industry Association, Current Chairman of the Packaging and Testing Branch of the China Semiconductor Industry Association, Evaluation Expert of the National Science and Technology Major Project 02 Special Professional Group, Jiangsu Province Second Industry Professor, and Industry Professor at Nanjing University of Posts and Telecommunications and Nantong University.

Li ZHENG  CEO of JCET Group, China

Mr. Zheng Li is a member of the board of directors and Chief Executive Officer at JCET Group Co., Ltd.  JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly and final test. 

Ming LI  Prof. of Shanghai Jiao Tong University, China

Graduated from Northeastern University with a bachelor's or master's degree and stayed on as a teacher. In 1999, he obtained a Ph.D. in Engineering from Kyushu University of Technology in Japan. From 1998 to 2003, he served as the Chief Researcher and Technical Director at Mitsui High tech Company (MHT) in Japan, mainly engaged in the design and research and development of electronic packaging technology and packaging materials.

Tim CHEN  General Manager of Yan Tai Darbond Technology Co., Ltd., China

Tim CHEN,  National level overseas high-level expert, member of the Advisory Committee of the National Integrated Circuit Material Industry Technology Innovation Strategy Alliance, director and member of the Expert Advisory Committee of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategy Alliance, has undertaken the National Science and Technology Major Project "Research and Industrialization of Bottom Filling Materials for Low k Inverted Core TCB Process" (02 Project), Hosted the National Key R&D Program project "Application Research on Underfill Materials for Narrow Gap Large Size Chip Packaging". In May 2010,Tim joined Darbond Technology Co., Ltd., and has served as a director and general manager of Darbond Technology Co., Ltd., executive director of Darbond Technology (Shenzhen) Co., Ltd., chairman of  Weishida Semiconductor Technology Co., Ltd., and chairman of Darbond Technology (Dongguan)Co., Ltd.

Zhiyi XIAO  General Manager of Huatian Technology(Kunshan) Co., Ltd., China

Leading talents in the "Double Innovation Team" in Jiangsu Province and the "Double Innovation Team" in Kunshan City, as well as "Jiangsu Science and Technology Entrepreneurs". Vice Chairman of China Semiconductor Industry Association, President of Kunshan Semiconductor Industry Association, and Expert of Jiangsu Province High end Equipment Expert Database.

Bin Zhou  Research professor Deputy chief engineer of Key Laboratory in the 5th Electronics Research Institute of the Ministry of Industry and Information Technology

Dr. Bin Zhou is the deputy chief engineer of the national key laboratory, He was named an provincial excellent middle-aged and youth and outstanding scientific and technological worker of the Chinese Institute of Electronics. Dr. Bin Zhou is the expert of Science and Technology department of Guangdong province and the deputy to Guangzhou people’s congress, he is also the member of the standards committee of China Materials and Test Team. His main research interest lies in the area of Advanced packaging, microsystem reliability and microelectronic device thermal management. 

Min MIAO  Prof. of Beijing Information Science and Technology University, China

Prof, Min Miao received his B.S. degree in Electrical Engineering from Beihang UniversityBeijing, China and Ph.D. degree in microelectronics from Peking University, Beijing, China.in 1995 in 2005, respectively. He joined the Faculty of Electronic & Communication Engineering, Beljing Information Science and Technology University (BISTU) in 2005, and appointed to the full professorship in 2013. He has annually lectured the courses on electromagnetics, microwave engineering and electromagnetic compatibility to both undergraduates and graduates. He founded the Information Microsystem Institute of BISTU in 2007 which has been rebuilt into Academy of Smart ICs and Networks (ASICNet) in 2021, and has since acted as the Director.

Shu'an DU  Hygon package design department manager

Shu'an DU, Hygon package design department manager, senior professional title of the Chinese Academy of Sciences. 17 years package design experience, responsible for Hygon CPU/DCU package design and Chiplet package Architecture methodology building, finished all Hygon CPU/DCU packaging designs so far, authorized more than 40 patents in this field, and applied for 3 international patents.

Jian CAI  Prof. of Tsinghua University, China

Graduated from the Department of Materials Science at Tsinghua University in July 1998 with a PhD in Engineering, as a postdoctoral researcher at the Hong Kong University of Science and Technology from 1999 to 2001, mainly engaging in the development and research of flip chip packaging technology; From 2001 to 2002, worked in technical research and development at Shenzhen Meilongxiang Company, leading the development of enhanced heat dissipation solder ball array packaging substrates; I have been working at the Institute of Microelectronics at Tsinghua University since 2002.

Mingliang HUANG  Prof. of Dalian University of Technology, China

Prof. Dr. Mingliang Huang, Head of Laboratory for Electronic Packaging Materials, Dean of School of Materials Science & Engineering of Dalian University of Technology, Dalian, China. Experts in the national plan for ten thousand people, Young and Middle-aged talents in Science and Technology Innovation of the Ministry of Science and Technology, Humboldt Fellow. Research interest focuses on the advanced interconnection technology and materials in electronic packaging.