2024 25th International Conference on Electronic Packaging Technology
English
Chinese
主办方
承办方
CONTACT US
Schoot of Electronic Science and Engineering
Dongxue LIANG
0086-0592-2188342
icept2021@xmu.edu.cn
Wen YIN
0086-010-82995675
Conference Registration
Fenghua GAN
0086-021-38953725
faithsh@yeah.net
Juanjuan ZHOU
0086-010-64655241
271617588@qq.com
Conference Sponsorship
Yueru SHI
0086-13661508648
janey.shi@cepem.com.cn
上海微电子装备(集团)股份有限公司(简称SMEE)主要致力于半导体装备、泛半导体装备、高端智能装备的开发、设计、制造、销售及技术服务。
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