2024 25th International Conference on Electronic Packaging Technology
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Meeting Secretary
Longnv LI
0086-13998290967(Submit Contact)
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Kunxia SONG
0086-13821459422
Yico WANG
0086-010-64655241
0086-13121110782
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
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2023年8月9-11日,第24届电子封装技术国际会议(ICEPT 2023)在中国美丽新疆石河子大学胜利召开。
来自海内外700位专业人士齐聚一堂、共享硕果,推动先进封装面向技术创新、学术交流与国际合作!
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