第24届电子封装技术国际会议在石河子大学成功举办
Date:
2023-09-28

Views:

0

第24届电子封装技术国际会议在石河子大学成功举办


 2023年8月9-11日,第24届电子封装技术国际会议(ICEPT 2023)在中国美丽新疆石河子大学胜利召开。

来自海内外700位专业人士齐聚一堂、共享硕果,推动先进封装面向技术创新、学术交流与国际合作!       


The 24th International Conferenc on Electronic Packaging Technology

The 24th International Conferenc on Electronic Packaging Technology

The 24th International Conferenc on Electronic Packaging Technology

The 24th International Conferenc on Electronic Packaging Technology

The 24th International Conferenc on Electronic Packaging Technology

The 24th International Conferenc on Electronic Packaging Technology